Biography
Biography: Rashid Rashidzadeh
Abstract
Full integration of all blocks and functions of a smart sensor into a single chip with current technologies is a challenging task. In addition to the sensor unit numerous blocks including interface unit, Analog to Digital Converter (ADC), processing unit and wireless communication element are needed to implement a smart sensor. Innovative technologies from diverse disciplines such as microelectromechanical systems (MEMS) and photonics bring new possibilities for integration of smart sensors while further raising the challenges of integration. 3D and 2.5D fabrication technologies are well suited for integration of smart sensors containing elements from various technology disciplines such as MEMS, microelectronics. This work presents the integration techniques in 3D IC technology to achieve low power and high performance smart sensors.